Advantest Introduces New Wafer MVM-SEM Tool E3310 |
||||
Advantest Introduces New Wafer MVM-SEM Tool E3310 |
||||||||
|
||||||||
| Supports Next-Generation Devices | |
|
|||
| WAFER MVM-SEM E3310 | |||
A Next-Generation 3D Measurement Solution |
||
| While advances in semiconductor technology have historically followed Moore's Law, technical challenges have recently imperiled the transition to yet-smaller processes. The development of 3D transistor technologies such as FINFET (fin-based field effect transistors) is expected to bridge the gap to mass production at the 22nm node and subsequently the 1Xnm node. Advantest's new E3310 provides a stable, highly accurate 3D measurement solution suitable for these next-generation needs. |
Product Features |
||
| 3D Measurement |
| The E3310's multi-detector configuration allows it to achieve stable, highly accurate measurements at the 1Xnm node. It also features a proprietary detection algorithm, enabling measurement of the 3D FinFET architectures that are in the process of full-scale adoption by the semiconductor industry. |
| Highly Stable, Fully Automatic Image Capture |
| The E3310 performs stable, fully automatic measurements even at high SEM magnification, thanks to its high-accuracy stage, charge control function, and contamination reduction technology. |
| Support for Diverse Wafer Types |
| Not only silicon wafers, but AlTiC, quartz, and silicon carbide wafers, among others, are supported in sizes from 150mm to 300mm, depends on type. |
| Further Inquiries |
| Nanotechnology Business Group | |
| email: info_nano@ml.advantest.com | |
| Note: | All information supplied in this release is correct at the time of publication, but may be subject to change. |