NIEC Announces Agreement with Cree for SiC Diodes in Japan

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http://www.niec.co.jp/english/ir/pdf/report/070718.pdf
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July 18, 2007
Hadano, Japan — July 18, 2007 — NIEC (Nihon Inter Electronics Corp.) (TSE:6974), a market leader in silicon-based discrete power semiconductors, today announced that it has signed an agreement un-der which NIEC will introduce next-generation silicon carbide (SiC)-based Schottky power rectifier diodes in Japan with die manufactured by Cree, Inc. “Silicon carbide offers numerous concrete benefits over silicon-based rectifiers

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