|
|
|
|
|
At Semicon Japan, Advantest will showcase its latest test systems and technologies, capitalizing on the strengths of both Advantest and Verigy products. These new systems help to lower the cost of test through increased parallel DUT testing capacity.
Also, Advantest will exhibit in the Front-end Zone for the first time, showcasing SEM that make multi dimensional observation and measurement possible, and will display the features and capabilities of its electron beam lithography system through graphic representation.
|
|
|
|
|
T2000 Enhanced Performance Package (Exhibition Hall 8) |
|
|
The T2000 offers customers a solution tailored to their testing needs with modules that can be combined flexibly. The new Enhanced Performance Package (EPP) together with modules supports Functional Test Abstraction (FTA), which enables system level IC design verification programs on ATE. The EPP and modules also features Multi Session capability, which allows multiple users to use the system at the same time, and is compatible with Concurrent Test, where multiple test programs can be executed in parallel. These features enable reduced lead time from design to functional testing of complex SoCs and lower cost in mass production.
|
|
|
|
|
V93000 Smart Scale (*) (Exhibition Hall 8) |
|
With a phase-synchronized circuit for each pin, the V93000 Smart Scale enables data rates to be set per pin, making System-like Stress Test, where the device under test is tested in conditions close to its actual use, possible. The system features four test head sizes, with seamless compatibility between them, meaning flexibility in regard to production volume changes. The Smart Scale A-Class, the smallest, will be on display at this year's exhibition.
(*): V93000 Smart Scale is a Verigy Product
|
|
|
|
|
E3630 Multi Vision Metrology SEM (Exhibition Hall 3) |
|
The E3630 is a new generation Multi Vision Metrology SEM that features multi-channel detection technology. The system not only features traditional Critical Dimension measurement capability, which utilizes electron-beam technology, but also 3D measurement capability, including Side Wall Angle technology, which is needed in 1Xnm process nodes.
|
