October 13, 2011
Hitachi Chemical Co., Ltd.
Expansion of Adoption of “White Epoxy Molding Compounds” for
LED Packages
—Lineup of materials for LED products expanded to 10 products—
Hitachi Chemical Co., Ltd. (Head Office: Tokyo; President and CEO: Kazuyuki Tanaka; Capital: 15.5 billion yen: hereinafter referred to as "Hitachi Chemical") has seen its “White epoxy molding compounds, CEL-W-7005 series” (hereinafter referred to as “white molding compounds”) for LED packages increasingly adopted by a range of customers. Hitachi Chemical has introduced ten materials including white molding compounds for LED products and is making concerted efforts to expand sales in the LED market where demand is expected to increase. The aim is to achieve total sales of about 8 billion yen in FY 2015.
The rate of adoption of LEDs as a new light source has been dramatically increasing due to their low power consumption and long service life. As examples of applications, LEDs are already being used for the back lighting of liquid crystal displays for PC monitors and TVs and are expected to become increasingly popular for use in illumination lamps, automobile headlights and in other similar applications. With the expansion of the market, LEDs are expected to have greater functionality and higher power. This results in LEDs operating at higher temperatures and imposes a greater load on the materials comprising the LED package. For these reasons, LED package materials need to be able to meet a number of more stringent requirements, including higher heat resistance, higher conductivity and better reliability.
To meet these needs, Hitachi Chemical has released white molding
compounds used for the reflector part of a package. This was made possible by
utilizing the technology of epoxy molding compounds for semiconductor packages,
an area in which we are particularly strong. A thermoplastic resin has previously
been used for this purpose, but due to its significant loss of reflectance at
high temperatures we have developed a new material, “CEL-W-7005”,
that maintains its reflectance even at high temperatures, and has a long life
and high reliability * . This development was made possible by devising a special
compound technique using thermosetting epoxy resin. This material exhibits excellent
formability and workability, and will help to enhance the productivity of our
customers. It has already been highly rated by our domestic and overseas customers,
and its adoption has been expanding with the popularization of LED products.
In addition to the white molding compounds, we are accelerating development and commercialization of materials for LED products, and have a current lineup of ten products. With this lineup as a basis, we are pursuing greater expansion of sales. We have established a full-time sales group that began operations on October 1. One function of the new group is to propose solutions using the most suitable combination of materials to meet the various design requirements and needs of customers, and the aim is to achieve total sales of about 8 billion yen in FY 2015 for the materials used for LED products.
| *: | Even after the material is used
for 1,000 hours at a temperature of 150ºC, it still retains 70% of its reflectance (initial reflectance: 93%). |
= Reference =
< White molding compound CEL-W-7005 >
< Molding sample >
< Use of Hitachi Chemical products in LED light bulb >
-
Package substrate
Aluminum substrate
-
Substrate material
HT-5100S
-
Substrate material
HT-5100M
*Released
on Sep. 27
-
Substrate material
HT-9000ITM
*Released
on Sep. 27
-
Substrate material
HT-9000IMC
-
Substrate material
HT-9000IMA
*Released
on Sep. 27
-
Thermally conductive adhesive tape
HT-8000
-
Thermal emission coating
HC-001
-
Package material
Die bonding
material (Under development)
< Lineup of materials for LED products other than white
molding compounds >
