Infineon and Fuji Enter Into Agreement for HybridPACKTM 2 Power Modules

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http://www.fujielectric.com/news/2012/12051001.html
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May 10, 2012
Fuji Electric Co., Ltd.


Joint news release by Infineon Technologies and Fuji Electric

Infineon and Fuji Enter Into Agreement for HybridPACKTM 2 Power Modules

Neubiberg and Nuremberg, Germany and Tokyo, Japan – May 9, 2012 – Fuji Electric Co., Ltd., and the chip manufacturer Infineon Technologies AG (FSE/NYSE: IFX) serve the automotive industry by extending the supplier base for power modules deployed in automotive hybrid and electrical vehicles (HEV)


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