Advantest Announces 3D TSV Stack Test Solutions |
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Advantest Announces 3D TSV Stack Test Solutions |
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| Integrated Test and Handling Thin Die and TSV Stack Production | |
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Enabling 2.5D and Partial Stack |
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| 2.5D- and 3D-stack technologies offer outstanding improvements to density, power and performance. The primary concerns of this emerging architecture are 1. Delicate and thin die handling, 2. Active thermal management, and 3. Overall yield management. The DIMENSION concept addresses these issues with SmartDieCarrier (SmtDCTM) technology. SmtDCTM solutions provide die pick & place plus very fine pitch contact with both extreme precision and delicate soft touch handling. And Active Thermal Control (ATC) with real time power management achieves yield and specification compliance. Adding confident yield to the 3D equation the Dimension concept enables stacked device commodity. |
Wide I/O DRAM |
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| True TSV 3D applications deliver outstanding performance with superb power reduction and physical density benefits. The JEDEC Wide I/O Mobile DRAM provides 8X the bandwidth with 1/4 to 1/2 the I/O power of conventional DRAM architectures. But today's market also demands highest yields with commodity class economy. Wide I/O DRAM and future 3D TSV heterogeneous devices will depend on KGS and superb productivity. The DIMENSION concept demonstrates KGD and KGS solutions for smart phones and tablets of tomorrow as well as the telecom routers and super computing CPUs now under development. More information on ADVANTEST EXPO 2012 is available at: http://www.advantestexpo2012.jp/en-index.html |
| Note: | All information supplied in this release is correct at the time of publication, but may be subject to change. |